Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability
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Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability
Stoyanov, Stoyan; Lu, Hua; Bailey, Christopher
World Scientific Publishing Co Pte Ltd
09/2025
300
Dura
Inglês
9789814740203
Pré-lançamento - envio 15 a 20 dias após a sua edição
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Packaging and Integration Technologies; Modelling Techniques and Tools; Design Techniques for Manufacture, Reliability and Robustness; Bumping Technologies; Through Silicon via and Micro-Via Technologies; Wafer level Packaging; Challenges and Solutions for High reliability Systems;
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Advanced Packaging and Manufacturing, Finite Element Modelling, Multi-Domain, Physics Modelling, Co-Design, Thermal Management, Reliability
Packaging and Integration Technologies; Modelling Techniques and Tools; Design Techniques for Manufacture, Reliability and Robustness; Bumping Technologies; Through Silicon via and Micro-Via Technologies; Wafer level Packaging; Challenges and Solutions for High reliability Systems;
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
