Metrology and Diagnostic Techniques for Nanoelectronics
portes grátis
Metrology and Diagnostic Techniques for Nanoelectronics
Seiler, David G.; Ma, Zhiyong
Pan Stanford Publishing Pte Ltd
10/2016
1454
Dura
Inglês
9789814745086
15 a 20 dias
1864
Descrição não disponível.
Model-Based Scanning Electron Microscopy Critical Dimension Metrology for 3D Nanostructures. X-Ray Metrology for Semiconductor Fabrication. Advancements in Ellipsometric and Scatterometric Analysis. 3D-AFM Measurements for Semiconductor Structures and Devices. Microstructure Characterization of Nanoscale Materials and Interconnects. Characterization of the Chemistry and Mechanical Properties of Interconnect Materials and Interfaces: Impact on Interconnect Reliability. Characterization of Plasma Damage for Low-? Dielectric Films. Defect Characterization and Metrology. 3D Electron Tomography for Nanostructures. Methodology and Challenges in Characterization of 3D Package Interconnection Materials and Processes. 3D Interconnect Characterization using Raman Spectroscopy. Optical and Electrical Nanoprobing for Circuit Diagnostics. Automated Tools and Methods for Debugging and Diagnosis.
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AIP Publishing;aip;Sim Ilar;publishing;Sm Aller;sam;Stru Ctu;ple;Sam Ple;rren;Agnetic Field;sem;CVD Graphene;iconductor;MOS Device;ages;Raman Spectroscopy;easurem;X-ray Computerized Tomography;ent;American Chemical Society;Sen Sor;SiGe Layer;Sample Preparation;Tran Sition;Atom Probe Tomography;IOP Publishing;Specimen;Solder Joint;Tren Ch;Trench;Form Ation;Resu Lts;Requ Ire;Eel Spectrum
Model-Based Scanning Electron Microscopy Critical Dimension Metrology for 3D Nanostructures. X-Ray Metrology for Semiconductor Fabrication. Advancements in Ellipsometric and Scatterometric Analysis. 3D-AFM Measurements for Semiconductor Structures and Devices. Microstructure Characterization of Nanoscale Materials and Interconnects. Characterization of the Chemistry and Mechanical Properties of Interconnect Materials and Interfaces: Impact on Interconnect Reliability. Characterization of Plasma Damage for Low-? Dielectric Films. Defect Characterization and Metrology. 3D Electron Tomography for Nanostructures. Methodology and Challenges in Characterization of 3D Package Interconnection Materials and Processes. 3D Interconnect Characterization using Raman Spectroscopy. Optical and Electrical Nanoprobing for Circuit Diagnostics. Automated Tools and Methods for Debugging and Diagnosis.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
AIP Publishing;aip;Sim Ilar;publishing;Sm Aller;sam;Stru Ctu;ple;Sam Ple;rren;Agnetic Field;sem;CVD Graphene;iconductor;MOS Device;ages;Raman Spectroscopy;easurem;X-ray Computerized Tomography;ent;American Chemical Society;Sen Sor;SiGe Layer;Sample Preparation;Tran Sition;Atom Probe Tomography;IOP Publishing;Specimen;Solder Joint;Tren Ch;Trench;Form Ation;Resu Lts;Requ Ire;Eel Spectrum
